Packages / openSUSE Leap 15.6 / Source / Hardware/Printing / cura-fdm-materials

Source Package: cura-fdm-materials (4.13.0-bp156.3.1)

FDM material database

The following binary packages are built from this source package:

Vulnerabilidades conocidas

No hay avisos coincidentes en las fuentes consultadas.

Última sincronización:

[Catálogo de CVE]

Fuentes

  • openSUSE Leap 15.6 OSSSep 1, 2026

    Authoritative source; repository metadata signature verified

    Prueba de firma

    leap-15-6-oss-multiarch:ca2653101b9afba6656aea529109ba0c0f1ca1a92aa8614e7c887fda5264c230

    Repository-signature verification record
    Signed-object SHA-256
    ca2653101b9afba6656aea529109ba0c0f1ca1a92aa8614e7c887fda5264c230
    Signer fingerprint
    AD485664E901B867051AB15F35A2F86E29B700A4
    Keyring revision
    opensuse-project-signing-key.asc
    SHA-256 b5745739ebfb95b25b8e810f9bcb847fe750ccda598bd85f02f0e974599a6d7e
    Tool and policy
    gpgv (GnuPG) 2.4.9
    openfactory-software-catalog-signature-v1
    Verification time
    Sep 1, 2026
    Repository metadata hash linkage
    Result
    Recorded as verified; digest details unavailable