Packages / openSUSE Leap 16.0 / Source / Hardware/Printing / cura-fdm-materials

Source Package: cura-fdm-materials (4.13.0-bp160.1.9)

FDM material database

The following binary packages are built from this source package:

Known vulnerabilities

No matching advisories in the tracked sources.

Last synced:

[CVE catalog]

Sources

  • openSUSE Leap 16.0 OSSSep 1, 2026

    Authoritative source; repository metadata signature verified

    Signature evidence

    leap-16-0-oss-multiarch:271b36d440253edf9871ac0c100319fc7443d8f2d54b6b449a72e9414c51577c

    Repository-signature verification record
    Signed-object SHA-256
    271b36d440253edf9871ac0c100319fc7443d8f2d54b6b449a72e9414c51577c
    Signer fingerprint
    AD485664E901B867051AB15F35A2F86E29B700A4
    Keyring revision
    opensuse-project-signing-key.asc
    SHA-256 b5745739ebfb95b25b8e810f9bcb847fe750ccda598bd85f02f0e974599a6d7e
    Tool and policy
    gpgv (GnuPG) 2.4.9
    openfactory-software-catalog-signature-v1
    Verification time
    Sep 1, 2026
    Repository metadata hash linkage
    Result
    Recorded as verified; digest details unavailable